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En casa > productos > máquina depaneling del PWB > YS-T3PLUS Stable Printing Quality High Speed and High Precision Pressure AdjustablePCB Fully Automatic Solder Paste Printer

YS-T3PLUS Stable Printing Quality High Speed and High Precision Pressure AdjustablePCB Fully Automatic Solder Paste Printer

Detalles del producto

Lugar de origen: Jiangsu, China

Nombre de la marca: YUSH

Pago y términos de envío

Cantidad de orden mínima: 1 juego

Precio: $13,900-18,800 / set

Obtenga el mejor precio
Resaltar:

fully automatic solder paste printer

,

high precision PCB printer

,

adjustable pressure solder printer

Peso:
900 kg
Altura de la parte trasera de la PCB:
10mm
Altura del transportador:
900±40m m
Distancia entre los bordes:
≥2.5mm
Velocidad del transportador:
0~1500 mm/s
Presión del raspador:
0 a 20 kg
Ángulo del raspador:
60°
Velocidad de impresión:
5-200 mm/s
Rango de vista:
9mm * 7mm
Exactitud posicional:
±0,01 mm
Precisión de impresión:
± 0,025 mm
Tiempo de ciclo:
<10s
Fuente de alimentación principal:
CA 220V el ±10% 50/60Hz
potencia total:
3kW
Dimensiones de la máquina:
1140x1380x1530mm
Peso:
900 kg
Altura de la parte trasera de la PCB:
10mm
Altura del transportador:
900±40m m
Distancia entre los bordes:
≥2.5mm
Velocidad del transportador:
0~1500 mm/s
Presión del raspador:
0 a 20 kg
Ángulo del raspador:
60°
Velocidad de impresión:
5-200 mm/s
Rango de vista:
9mm * 7mm
Exactitud posicional:
±0,01 mm
Precisión de impresión:
± 0,025 mm
Tiempo de ciclo:
<10s
Fuente de alimentación principal:
CA 220V el ±10% 50/60Hz
potencia total:
3kW
Dimensiones de la máquina:
1140x1380x1530mm
YS-T3PLUS Stable Printing Quality High Speed and High Precision Pressure AdjustablePCB Fully Automatic Solder Paste Printer
YS-T3PLUS Fully Automatic Solder Paste Printer
High-speed, high-precision PCB solder paste printer with stable printing quality and adjustable pressure control.
YS-T3PLUS Stable Printing Quality High Speed and High Precision  Pressure  AdjustablePCB Fully Automatic Solder Paste Printer 0
Key Features
  • Automatic adjustable squeegee pressure balancing
  • Intelligent 2D inspection system
  • Dry and wet cleaning with optional vacuum cleaning
  • Thin board printing capability (optional)
  • Advanced mark point recognition technology
  • China's first online calibration technology
System Overview
YS-T3PLUS Stable Printing Quality High Speed and High Precision  Pressure  AdjustablePCB Fully Automatic Solder Paste Printer 1
  • Rack module
  • Lifting module
  • Platform alignment module
  • Housing module
  • Image capture module
  • Stencil frame positioning module
  • Squeegee module
  • Display module
  • Cleaning module
  • Conveyor module
  • Air and power input
Technical Specifications
Basic Parameters
Screen Frame Size (mm)520(X)×420(Y)-737(X)×737(Y)
Thickness: 20-40mm
Minimum PCB (mm)50(X)×50(Y)mm
Maximum PCB (mm)400(X)×310(Y)mm
PCB Thickness0.2mm-6mm (Use jig when PCB less than 0.4mm)
PCB Curve< 1% (Diagonal measurement)
PCB Backside Part Height10mm
Conveyor Height900 ±40mm
Support OptionsMagnetic support, Magnetic piece, Vacuum chamber (Optional)
Clamp SystemSide clamp (Standard)
Edge DistancePCB process edge ≥2.5mm
Conveyor Speed0-1500mm/s, increment 1mm
Conveyor BeltU type sync belt
Stopper MethodAir cylinder
Flow DirectionL-R, R-L, L-L, R-R (customer configurable)
Print System
Print Speed5-200mm/s adjustable
Print HeadStep motor drive scraper lifting
Scraper OptionsSteel scraper, Rubber scraper (optional)
Scraper Angle60°
Scraper Pressure0-20kg
Vision System
Substrate SeparationThree-section: Speed 0.1-20mm/s, Distance 0-20mm
Alignment MethodMark Automatic aligning
CameraGermany BASLER, 1/3" CCD, 640×480 pixel, 5.6μm pixel size
Image AcquisitionUpper/under double photo
Camera LightingCoaxial light, Ring light (four adjustable light types)
View Range9mm×7mm
Mark DimensionsDiameter or side length 1mm-2mm, allowable offset 10%
Mark ShapesCircle, Rectangle, Rhombus, etc.
2D DetectionStandard
Accuracy & Timing
Table Adjusting RangeX=±10mm, Y=±10mm, θ=±1.5°
Positional Accuracy±0.01mm
Printing Accuracy±0.025mm
Cycle Time< 10s (excluding print and cleaning time)
Line Conversion Time< 5 minutes
Programming Time< 10 minutes
Control & Power Systems
Computer ConfigurationIndustrial PC, Windows official system
User Interface LanguagesChinese, English
Machine ConnectivitySMEMA interface
User AuthorizationUser PW and Senior PW settings
Cleaning SystemDry and Wet (standard), Vacuum model (optional)
Liquid Level DetectionAuto alarm detection
Main Power SupplyAC 220V ±10%, 50/60Hz Single phase
Total PowerApproximately 3kW
Main Air Supply4.5-6kgf/cm²
Machine WeightApproximately 900kg
Machine Dimensions1140(L)×1380(W)×1530(H)mm
Optional Features
  • Pneumatic top clamp for PCB (thickness ≤1mm)
  • Top clamp + side clamp for PCB (thickness ≤1mm)
  • Vacuum adsorption and clean for PCB (thickness ≤1mm) and FPC
  • Auto solder paste addition system
  • Automatic loading and unloading
  • Flexible universal support for double-sided PCB (backside parts height ≤9mm)
  • Automatic screen frame positioning
  • PCB board thickness automatic adjustment
  • Scraper pressure real-time feedback
  • Solder paste residue monitoring system
  • SPI closed loop control
  • UPS 15-minute power off protection
  • Industry 4.0 features: Barcode trace function, Production analysis