Resaltar: 
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                SMT high speed dicing machine, semi automatic PCB depaneling machine, production line dicing machine with warranty
                              

Peso:	850 kilogramos	Fuerza:	10 kW
Voltaje:	220V/110V	movimiento de Y-AXIS:	310 mm
Dimensiones:	104010801750mm	Consumo de aire:	200 l/min
Potencia de la máquina:	4 kilovatios	Presión de aire:	0.5-0.6MPA
Diámetro de material máximo:	300 milímetros	Potencia del husillo:	2,4 KILOVATIOS
Velocidad del husillo:	60,000 rpm	Precisión de posicionamiento:	0.001 mm
Velocidad de corte:	0,05-400 mm/s	Hoja estándar:	2 pulgadas
Hoja máxima:	3 pulgadas

Peso:	850 kilogramos
Fuerza:	10 kW
Voltaje:	220V/110V
movimiento de Y-AXIS:	310 mm
Dimensiones:	104010801750mm
Consumo de aire:	200 l/min
Potencia de la máquina:	4 kilovatios
Presión de aire:	0.5-0.6MPA
Diámetro de material máximo:	300 milímetros
Potencia del husillo:	2,4 KILOVATIOS
Velocidad del husillo:	60,000 rpm
Precisión de posicionamiento:	0.001 mm
Velocidad de corte:	0,05-400 mm/s
Hoja estándar:	2 pulgadas
Hoja máxima:	3 pulgadas

SMT High Speed Semi Automatic Dicing Machine for Production Line

The dicing system utilizes a slim cutting blade mounted on a high-speed spindle to precisely cut materials including glass, ceramic, semiconductor chips, PCB, EMC wire frames, and other substrates with exceptional accuracy.

Operation Procedures

Wafer or Strip

Tape mounting

Dicing

Cleaning

UV separation

Semi-Automatic Dicing System Description

The semi-automatic dicing system features manual loading and unloading operations while automating the core dicing procedure. This system does not include automatic cleaning or drying functions.

Main Procedures

Feeding by hand

Position align

Auto-cutting

Unloading by hand

Operator manually places cutting material on work platform
Automatic calibration of cutting position
Press start button to automatically complete dicing process
Operator manually removes finished material from work platform

Applications

Automatic dicing systems are widely used for precision cutting of semiconductor chips, LED chips, EMC lead frames, PCB boards, IR filters, sapphire glass, and ceramic thin plates.

Ceramic substrate

Silicon rubber

Lead frame

Silicon wafer

PCB

Glass

Operating Requirements

Use clean compressed air with atmospheric pressure dew point of -10°C to -20°C, residual oil content of 0.1ppm, and filtration accuracy above 0.01μm/99.5%
Operate in environment temperature of 20°C to 25°C with fluctuation range controlled at ±1°C
Maintain cutting water temperature at 22°C to 27°C (±1°C variation) and cooling water at 20°C to 25°C (±1°C variation)
Avoid external impacts and vibrations; do not install near high-temperature devices like blowers or vents, or equipment generating oil mist
Strictly follow provided product manual for operation

YSL-1000SD Semi-Dicing System Features

Control Interface	Touch LCD with simple interface design, multiple language support (Chinese, English, Korean)
Maximum Material Size	300mm diameter high precision cutting capability
Structural Design	High rigidity design ensuring precision and stability during cutting process
Alignment System	CCD automatic alignment
Monitoring System	Real-time monitoring of air pressure, water pressure, current values to prevent spindle damage
Cutting Spindle	2.4 kW × 1 set (Maximum: 60,000 rpm)
Positioning Accuracy	0.001mm repeat positioning accuracy
Cutting Speed	0.05 ~ 400 mm/sec
Standard Blade	2 Inch (Maximum: 3 Inch)

Case Sharing

Optional Equipment

Blade damage detection function
Automatic setting function
Dicing visual function
3-inch dicing blade compatibility

Platform Capacity Comparison

Standard 8-inch working platforms accommodate only 2 pieces of material. The SDS1000/ADS2000 models feature 12-inch chucks capable of holding 4 pieces per cycle, reducing loading times, accommodating larger products, and improving efficiency by over 8%.

Tags:

PWB cortado de la máquina del PWB Depaneling de la mesa que muele que encamina el equipo de Depaneling para la fabricación del PWB

Obtenga el mejor precio

máquina depaneling del PWB

Router del PWB Depaneling

separador del PWB

máquina de dispensación del pegamento

punzonadora del PWB

Máquina cortada V del PWB

Transportador del PWB

Máquina del laser Depaneling

Caja seca desecante

aspiradores secos mojados industriales

Máquina que suelda de la barra caliente

Cortadora del LED

Máquina de la limpieza del PWB

Máquina de la limpieza de la plantilla

Cortadora de la plantilla del laser

Selección de SMT y máquina del lugar

Horno del flujo de la soldadura

Impresora de la goma de la soldadura

Máquina en línea de la marca del laser

Máquina de corte por láser de fibra

Impresora de la goma de la soldadura del PWB

Máquina de inserción automática

Máquina de soldadura selectiva

Planta de fabricación de SMT

SMT High Speed Semi Automatic Dicing Machine for Production Line

SMT high speed dicing machine

semi automatic PCB depaneling machine

production line dicing machine with warranty

depanelizer del PWB,

Máquina del separador del PWB,